ʻO ka hopena o nā Mīkini Punching Kiʻekiʻe ma ka ʻoihana Semiconductor

Me ka hoʻomau mau ʻana o ka ʻenehana a me ka hoʻonui nui ʻana o ka hoʻohana ʻana o nā semiconductor ma nā ʻano āpau, ka hopena oTaijishan kiʻekiʻe-wikiwikiKe ulu nui nei nā mīkini kuʻi ma ka ʻoihana semiconductor. Ma keʻano he mea hanaʻoihana i hoʻohana nuiʻia i ke kaʻina hana stamping, hiki i nā mīkini punching kiʻekiʻe ke hana i nā mea likeʻole me ka wikiwiki, pololei, a me ka maikaʻi, e hāʻawi ana i ke kākoʻo loea koʻikoʻi no ka hana semiconductor. E ʻimi kēia ʻatikala i ka hopena o nā mīkini punching kiʻekiʻe ma ka ʻoihana semiconductor mai nā hiʻohiʻona he nui a hāʻawi i nā hiʻohiʻona kikoʻī a me nā pono ʻoihana.

I. Nā noi o nā Mīkini Punching Kiʻekiʻe i ka ʻOihana Semiconductor

He hana koʻikoʻi nā mīkini punching kiʻekiʻe i ka ʻoihana semiconductor a hoʻohana nui ʻia i nā wahi aʻe:

Ka hana 'ana o ka hui kaapuni (IC) conductive combs: Conductive combs he mea nui o ka hui kaapuni, a me ko lakou mau kinona pono kiʻekiʻe precision a maʻamau. He kuleana koʻikoʻi nā mīkini kuʻi kiʻekiʻe i ka hana ʻana i nā pahu conductive, e hiki ai i ka hana wikiwiki o nā pahu conductive me nā ʻano maʻamau a me kahi hiʻohiʻona nani.

Ka hana ʻana o nā kolamu keleawe chip: ʻO nā kolamu keleawe chip he ʻāpana koʻikoʻi o ka hui ʻana o ka chip a hoʻohana ʻia e hoʻopili i ka chip me ka papa PCB. Hiki i nā mīkini paʻi kiʻekiʻe ke kuʻi wikiwiki i nā kolamu keleawe chip maʻamau mai nā mea keleawe, me ka hana kiʻekiʻe a me ke ʻano kiʻekiʻe, kūpono i nā koi hana kiʻekiʻe a me ka nui.

ʻO ka hana micro i nā kaʻina hana chip: ʻO nā mīkini punching kiʻekiʻe ka hana nui i ka micromachining semiconductor, ʻoi aku ka nui o ka ʻāpana chip a me ka hoʻohua ʻana. Hiki i nā mīkini kuʻi kiʻekiʻe ke hoʻopuka koke i nā chips kiʻekiʻe, me nā kumukūʻai haʻahaʻa a me ka hana kiʻekiʻe.

II. Nā Pōmaikaʻi o nā Mīkini Punching Kiʻekiʻe i ka ʻOihana Semiconductor

I ka ʻoihana semiconductor, ʻoi aku ka maikaʻi o nā mīkini punching kiʻekiʻe:

ʻO ka hana kiʻekiʻe kiʻekiʻe: ʻO nā mīkini punching kiʻekiʻe kiʻekiʻe ka hana kiʻekiʻe e hiki ke hoʻokō i ka koi no ka hana nui, hoʻonui i ka hana hana a me ka hiki i ka hana semiconductor.

Kiʻekiʻe kiʻekiʻe: Hiki i nā mīkini punching kiʻekiʻe ke hana wikiwiki i nā ʻāpana kiʻekiʻe kiʻekiʻe a me ke ʻano kiʻekiʻe, e hoʻokō i ke ʻano a me nā koi pololei i ka hana semiconductor.

ʻO ke kumu kūʻai haʻahaʻa: Ke hoʻohālikelike ʻia me nā mea hana ʻē aʻe, ʻoi aku ka haʻahaʻa o ke kumukūʻai o nā mīkini punching kiʻekiʻe, a ʻo kāna mau pono nui i ka hana pono a me ka pololei e hoʻemi i ke kumukūʻai o ka hana semiconductor.

Kiʻekiʻe kiʻekiʻe o ka automation ma nā laina hana: ʻO nā mīkini punching kiʻekiʻe ka maʻalahi, e hōʻemi ana i nā kumukūʻai hana me ka hoʻonui ʻana i ka pono hana a me ke kūpaʻa o ka laina hana.

III. Nā hihia kiko'ī o nā Mīkini Puni Kiʻekiʻe ma ka ʻOihana Semiconductor

Kyocera Electronic Devices: ʻO Kyocera Electronic Devices kahi hui e hana nui i nā mea uila. Ke hoʻohana nei kēia hui i nā mīkini punching kiʻekiʻe e hana i nā kolamu keleawe a me nā hui conductive i nā semiconductor, e hoʻonui ana i ka pono hana a hoʻemi i nā kumukūʻai hana.

ʻO Osram: ʻO Osram Group kahi hui hana kukui a me semiconductor. Hoʻohana ka hui i nā mīkini punching kiʻekiʻe e hana i nā hui conductive semiconductor me ka maikaʻi o ka huahana kiʻekiʻe a me ka hana pono.

Littelfuse: He mea hana kaapuni i hoʻohui ʻia ʻo Littelfuse. Ke hoʻohana nei kēia hui i nā mīkini punching kiʻekiʻe i nā laina hana e hana i nā combs conductive, nā kolamu keleawe, a me nā ʻāpana ʻē aʻe, e hoʻomaikaʻi ana i ka hana pono a me ka hōʻoia ʻana i ka maikaʻi o ka huahana.

 

Ka hopena

I ka hōʻuluʻulu ʻana, hana koʻikoʻi nā mīkini punching kiʻekiʻe i ka ʻoihana semiconductor a loaʻa iā ia nā pōmaikaʻi nui. Me ka hoʻomohala mau ʻana o ka ʻenehana, e hoʻomau ka hoʻomaikaʻi ʻana o nā mīkini punching kiʻekiʻe i ka hana pono, pololei, a me ka automation, e hāʻawi ana i ke kākoʻo ʻenehana paʻa no ka hoʻomohala ʻana i ka ʻoihana semiconductor.

He mea nui e hoʻomaopopo i ka hāʻawi ʻana o nā mīkini punching kiʻekiʻe i nā pono he nui, aia kekahi mau pilikia e pili ana i kā lākou hoʻohana ʻana, e like me ka pōʻino o nā mea hana, a me nā pōʻino palekana no nā limahana. No laila, he mea koʻikoʻi i nā ʻoihana ke hana mua i ka palekana o ka wahi hana a hōʻoia i ka loaʻa ʻana o nā limahana i ka hoʻomaʻamaʻa kūpono e pili ana i ka hana a mālama ʻana i kēia mau mīkini, e pale ai i nā pōʻino a me nā ʻeha.

Ma keʻano holoʻokoʻa, he mea koʻikoʻi ka hopena o nā mīkini punching kiʻekiʻe ma ka ʻoihana semiconductor, me ka hiki ke hoʻonui i ka pono hana, precision, a me ka automation. Ke hoʻomau nei ka noi no nā semiconductor, e hoʻonui wale ka mea nui o kēia mau mīkini, pono ia i nā ʻoihana e hoʻomaikaʻi i ka hoʻololi ʻana.

Hiki i nā mīkini kuʻi kiʻekiʻe ke hoʻololi i nā mold e like me nā koi o nā ʻāpana like ʻole, a hiki ke hoʻokō i ka hana hoʻomau mau i nā keʻena hana he nui, e hoʻomaikaʻi nui ana i ka hana pono a me ka maʻalahi. No ka hoʻololi wikiwiki ʻana o ka mākeke i ka ʻoihana semiconductor, hāʻawi nā mīkini punching kiʻekiʻe i nā ʻano hana agile a maʻalahi.

3 、 Ka hopena

Me ka hoʻonui mau ʻana o ka mākeke kaʻa kaʻa hou, nā mīkini punching kiʻekiʻe, ma ke ʻano he hana kūpono, pololei, mālama ʻana i ka ikehu a me ke kaiapuni, e pāʻani i kahi hana koʻikoʻi i ka hana o ka ʻoihana semiconductor.

leka uila

WhatsApp

Pili No.